SI Analysis

3 SPOT TECHNOLOGIES

Your trusted partner for engineering analysis

3 Spot Technologies is your premier destination for Signal Integrity (SI) Analysis services, a crucial component of our comprehensive engineering solutions. We recognize that ensuring signal integrity is paramount for the performance and reliability of electronic systems. With our vast expertise and unwavering commitment to excellence, we offer a comprehensive suite of services designed to optimize signal integrity within your designs.

Our Expertise

Our team of experienced engineers and experts utilize advanced tools and methodologies to analyze, model, and improve signal integrity in electronic systems. We focus on reducing signal degradation, minimizing interference, and ensuring that your designs meet the highest performance standards.

Why Choose Us?

Analysis and Modeling

We conduct in-depth signal integrity analysis and develop models to assess signal behavior, identifying potential issues and optimizing performance.

Interconnect Design

We prioritize optimizing the design of interconnects and signal paths, ensuring minimal signal loss and reflections.

Noise Reduction

We identify and mitigate sources of electromagnetic interference (EMI), enhancing the overall performance and functionality of your electronic systems.

Component testing

We can test all types of electronic components to ensure that they meet their specifications. This includes testing for electrical performance, environmental tolerance, and reliability.

Collaboration

We work closely with our clients, offering transparent communication and collaboration throughout the analysis process to ensure your goals are met.

Thermal Simulation:

  • Electrical & Thermal Co Simulation
  • Heat Sink & Cooling method proposal
  • System Level Thermal Simulation

Tool Experts:

  • ANSYS SI WAVE & HFSS
  • ADS
  • CADENCE SIGRITY

Simulation Expert

  • Stack-up- Design
  • Pre & Post Layout Simulation
  • Model Extraction, S-parameter & RLC Parasitic Extraction also Transmission line modeling and Crosstalk Simulation.
  • 3D Via modeling for high speed signal
  • Multi Board Simulation
  • (DDR-5 /DDR-4 /DIMM-DDR4 / QSFP-DD-100Ghz /SATA 3.0 & 3.1/ PCIe 2.0 & 3.0/ HDMI /USB 2.0 & 3.0 / SGMII & RGMII / High speed Ethernet PoE / QSPI /NVMe / Interposer DDR4 / CAN-Highspeed /GDDR5

Power Integrity

PDN AC & DC Simulation:

  • DC IR DROP
  • PDN Impedance AC / Decoupling Analyze
  • Power plane noise Analyze